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Failure analysis and reliability of 3D integrated systems

 
: Ramm, P.; Klumpp, A.; Franz, G.; Kwakman, L.

International Microelectronics and Packaging Society -IMAPS-; Global Business Council -GBC-:
IMAPS International Conference and Exhibition on Device Packaging : In Conjunction with the Global Business Council, GBC 2011 Spring Conference
2011
pp.295-299
International Conference and Exhibition on Device Packaging <7, 2011, Scottsdale>
English
Conference Paper
Fraunhofer EMFT ()

: http://publica.fraunhofer.de/documents/N-253989.html