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Failure analysis and reliability of 3D integrated systems
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2011
Conference Paper
Titel
Failure analysis and reliability of 3D integrated systems
Author(s)
Ramm, P.
Klumpp, A.
Franz, G.
Kwakman, L.
Hauptwerk
IMAPS International Conference and Exhibition on Device Packaging
Konferenz
International Conference and Exhibition on Device Packaging 2011
Language
English
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Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT