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Packaging and integration concept for high-performance and cost-effective IQM-based transmitter module for 160 Gb/s applications

: Delrosso, G.; Curran, B.; Rothermund, M.; Maaß, U.; Oppermann, H.; Ndip, I.

International Microelectronics and Packaging Society -IMAPS-:
IMAPS 2011, 44th International Symposium on Microelectronics. Proceedings. Vol.1 : Long Beach, California, USA, 9 - 13 October 2011
Red Hook, NY: Curran, 2012
ISBN: 978-1-618-39850-5
International Symposium on Microelectronics (IMAPS) <44, 2011, Long Beach/Calif.>
Conference Paper
Fraunhofer IZM ()

Photonic packaging and interconnection design of Polarization Multiplexed RZ-DQPSK format are actually gaining interests because of the urgent need to fit 100+ Gbit/s channels into existing DWDM systems, with the associated advantage to use driving electronics at the effective speed-rate needed for each driving port. However, packaging and integration of IQM (In-phase/Quadrature Modulator) chips for 100+Gb/s applications poses huge design and process challenges. In this contribution, we present a systematic concept for efficient and cost-effective packaging and integration of a 4 × 43 Gb/s Polmux RZ-DQPSK transmitter module for 160 Gb/s applications. This concept takes into consideration electrical and thermo-mechanical design challenges right at the beginning of the design cycle, so as to prevent any system failure or possible re-designs. The two InP IQM chips are flip-chip bonded on a BGA-based ceramic package, preserving signal integrity, simplifying routing and dram atically minimizing overall size and assembly costs.