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Capturing interface toughness parameters from shear testing using different fracture mechanics approaches

 
: Auersperg, J.; Dudek, R.; Brämer, B.; Pufall, R.; Seiler, B.; Michel, B.

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. Proceedings : 5 - 7 December 2012, Resort World Sentosa, Singapore
New York, NY: IEEE, 2012
ISBN: 978-1-4673-4553-8 (Print)
ISBN: 978-1-4673-4551-4 (Online)
pp.467-473
Electronics Packaging Technology Conference (EPTC) <14, 2012, Singapore>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
Simple adhesion tests like the pull-out test or the button shear tests have been used in industry for decades. They offer a great potential for comparison of different molding compounds, encapsulants, or adhesives on different types of substrates with or without surface treatment. However, for theoretical prediction purposes, interface fracture mechanics parameters are needed. Quantitative evaluations of the test applied to molding compound (MC)-button on Cu-leadframe by different fracture- and damage mechanical approaches are the subjects of the paper. Defect tolerant methodologies like the "virtual crack closure technique" (VCCT) and the J-inter-action integral approach, which consider the interface initially delaminated, are compared to the damage methodology "cohesive zone modelling (CZM)", which needs no initial crack and can track the delamination progress. Calculated fracture parameters, in particular the energy release rates and mode mixity are compared. Effects on these parameters are discussed for different button shapes. In-situ tracking of dela-mination progress for a cubic button is shown using the optical correlation technique microDAC.

: http://publica.fraunhofer.de/documents/N-252474.html