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Large area patterning of high-density interconnects by novel UV-excimer lithography and photo patternable ORMOCERTM-dielectrica
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2001
Conference Paper
Titel
Large area patterning of high-density interconnects by novel UV-excimer lithography and photo patternable ORMOCERTM-dielectrica
Author(s)
Robertsson, M.
Haglund, J.
Johansson, C.
Gibaud, P.
Lambert, D.
Popall, M.
Fröhlich, L.
Tolvgard, A.
Alping, A.
Linden, L.
Rodekirch, J.
Zemel, M.I.
Nunes, C.C.
Hauptwerk
13th European Microelectronics and Packaging Conference & Exhibition 2001. Conference proceedings. CD-ROM
Konferenz
European Microelectronic and Packaging Conference & Exhibition (EMPC) 2001
Language
English
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Fraunhofer-Institut für Silicatforschung ISC