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Systematic design and optimization of bond wire antennas using the M3-approach

 
: Ndip, I.; Guttowski, S.; Reichl, H.; Lang, K.D.

:

Institute of Electrical and Electronics Engineers -IEEE-:
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). Proceedings : December 9-11, 2012, Taipei, Taiwan
Piscataway, NJ: IEEE, 2012
ISSN: 2151-1225
ISBN: 978-1-4673-1444-2
pp.85-88
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) <2012, Taipei>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In this paper, all the three steps required for implementing the M3-approach are illustrated for bond wire antennas. First, a methodology for efficient and accurate electromagnetic modeling of bond wire antennas, based on parameterized models of the shape and length of bond wires, is developed. The resulting model is experimentally verified and applied to extensively study the RF performance of bond wire antennas. Based on these studies, reliable design measures are derived.

: http://publica.fraunhofer.de/documents/N-242000.html