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Silicon interposers with TSVs - a basis for wafer level 3D system integration

 
: Zoschke, Kai; Wolf, J.; Ehrmann, Oswin; Lang, Klaus-Dieter

Gessner, Thomas (Ed.) ; Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2013. CD-ROM : Amsterdam, The Netherlands, 13 - 14 March 2013, 7th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components
Berlin: VDE-Verlag, 2013
ISBN: 978-3-8007-3490-0
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <7, 2013, Amsterdam>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This manuscript contains a detailed description of the fabrication steps for processing of silicon interposers with copper filled TSVs at 200mm and 300mm wafer level as well as their subsequent assembly treatment. A subsequent introduction of produces evaluation devices explains and outlines the vasatility of the silicon interposer approach to be a flexible base technology for different application scenarios.

: http://publica.fraunhofer.de/documents/N-241530.html