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Cross section analysis of Cu filled TSVs based on high throughput plasma-FIB milling

: Altmann, F.; Beyersdorfer, J.; Schischka, J.; Krause, M.; Franz, G.; Kwakman, L.

American Society for Metals -ASM-, Metals Park/Ohio; ASM International:
ISTFA 2012, conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA
Materials Park, Ohio: ASM International, 2012
ISBN: 1-615-03979-1
ISBN: 978-1-615-03979-1
ISBN: 978-1-615-03995-1
International Symposium for Testing and Failure Analysis (ISTFA) <38, 2012, Phoenix/Ariz.>
Conference Paper
Fraunhofer IWM ()
Vion Plasma-FIB system; Plasma-FIB (P-FIB) milling strategies; grain structure analyses; high resolution interface characterisation; TEM

In this paper, the new Vion Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.