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Enhanced comparison of lock-in thermography and magnetic microscopy for 3D defect localization of system in packages

: Schmidt, C.; Altmann, F.; Vallett, D.P.

American Society for Metals -ASM-, Metals Park/Ohio; ASM International:
ISTFA 2012, conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA
Materials Park, Ohio: ASM International, 2012
ISBN: 1-615-03979-1
ISBN: 978-1-615-03979-1
ISBN: 978-1-615-03995-1
International Symposium for Testing and Failure Analysis (ISTFA) <38, 2012, Phoenix/Ariz.>
Conference Paper
Fraunhofer IWM ()
image-based fault isolation methods; lock-in thermography; magnetic current imaging

Lock-in thermography and magnetic current imaging are emerging as the two image-based fault isolation methods most capable of meeting the challenges of short and open defect localization in thick, opaque assemblies. Such devices are rapidly becoming prevalent as 3D integration begins to ramp up production. This paper expands on previously published work with a qualitative comparison of the techniques on single chip and stacked die packages with known designed-in or FIB-created defects.