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A flip-chip packaged coplanar 94 GHz amplifier module with efficient suppression of parasitic substrate effects

Ein in Flip-Chip Technik aufgebautes, koplanares 94 GHz Verstärkermodul mit effizienter Unterdrückung von unerwünschten Substratmoden
 
: Tessmann, A.; Riessle, M.; Kudszus, S.; Massler, H.

:

IEEE microwave and wireless components letters 14 (2004), No.4, pp.145-147
ISSN: 1051-8207
ISSN: 1531-1309
English
Journal Article
Fraunhofer IAF ()
coplanar waveguide; koplanare Wellenleiter; flip-chip packaging; Flip-chip Aufbautechnik; GaAs; lossy substrate; verlustbehaftetes Substrat; MMIC; monolithic millimeterwave integrated circuit; W-Band

Abstract
A flip-chip mounted W-band amplifier module with more than 15 dB gain between 82 and 105 GHz has been developed, based on a 0.15 µm GaAs PHEMT technology. To predict the influence of the flip-chip transition, an equivalent circuit model of the flip-chip interconnects was developed. Lossy silicon (n-Si) flip-chip carriers were used to successfully minimize parasitic substrate modes and feed back effects. The flip-chip assembled coplanar 94 GHz amplifier MMIC was packaged in a WR-10 waveguide mount, using CPW-to-waveguide transitions realized an quartz substrates.

: http://publica.fraunhofer.de/documents/N-23592.html