Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Thermal laser separation - damage-free and Kerfless cutting of wafers and solar cells

 
: Koitzsch, Matthias; Lewke, Dirk; Kaule, Felix; Oswald, Marcus; Schoenfelder, Stephan; Turek, Marko; Büchel, Andreas; Zühlke, Hans-Ulrich

:
Fulltext urn:nbn:de:0011-n-2281062 (501 KByte PDF)
MD5 Fingerprint: 9b58f7b5cf5c98c427d25da51d464dca
Created on: 20.2.2013


Institut National de L'Energie Solaire -INES-:
6th International Workshop on Crystalline Silicon for Solar Cells, CSSC 2012 : October 8-11, 2012, Aix-les-Bains, France
Aix-les-Bains, 2012
4 pp.
International Workshop on Crystalline Silicon Solar Cells (CSSC) <6, 2012, Aix-les-Bains>
English
Conference Paper, Electronic Publication
Fraunhofer IISB ()
Fraunhofer IWM ()
Kerfless cutting; crystalline silicon; solar cell; wafer dicing

Abstract
Thermal Laser Separation (TLS) is a damage free and kerfless dicing technology for brittle materials like silicon (Si) wafers and solar cells. By using a defined stress field, due to laser-based heating and subsequent water cooling, one single crack is guided through, e.g., a silicon substrate. This paper describes important aspects and benefits of TLS thus deriving major potential photovoltaic (PV) applications for TLS. Latest experimental results, finite element (FE) simulations, as well as theoretical considerations are taken into account. As a result, TLS is as a novel technology for cutting crystalline solar cells and wafers.

: http://publica.fraunhofer.de/documents/N-228106.html