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Thermal laser separation and its applications

 
: Lewke, Dirk; Koitzsch, Matthias; Schellenberger, Martin; Pfitzner, Lothar; Ryssel, Heiner; Zühlke, Hans-Ulrich

Future fab international 42 (2012), pp.118-122
ISSN: 1363-5182
English
Journal Article
Fraunhofer IISB ()
thermal laser separation; SiC; resizing; dicing; laser; chip separation; kerfless; Si

Abstract
The novel Thermal Laser Separation (TLS) technology allows for kerf-free dicing of brittle materials by crack guiding through thermally induced mechanical stress. Several benefits like a zero kerf and a high edge quality make it a promising technology for special applications: dicing of silicon carbide (SiC) with feed rates up to 200 mm/s, resizing of silicon wafers and dicing through pn-junctions of silicon diodes.

: http://publica.fraunhofer.de/documents/N-227863.html