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Ultra Thin ICs Open New Dimensions for Microelectronic Systems

 
: Klink, G.; Landesberger, C.; Feil, M.; Ansorge, F.; Aschenbrenner,R.

Advancing microelectronics 27 (2000), No.4, pp.23-25
ISSN: 2222-8748
English
Journal Article
Fraunhofer IZM ()
wafer thinning; ultra thin chip; packaging; thin chip integration

Abstract
With advanced wafer thinning technology ultra thin and mechanically flexible integrated circuits can be manufactured. These chips can be used in a growing number of innovative applications. This vertical miniaturization has its impact on assembly and packaging technology, which has to fit the specific requirements related to chips, which are thinner than paper.

: http://publica.fraunhofer.de/documents/N-2252.html