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Cold embossing of ceramic green tapes

: Haertel, A.; Richter, H.-J.; Moritz, T.

Journal of microelectronics and electronic packaging 9 (2012), No.3, pp.138-143
ISSN: 1551-4897
Journal Article
Fraunhofer IKTS ()

Hot embossing of ceramic green tape allows high throughput manufacturing. Tensile tests were carried out to investigate the embossing ability of alumina green tape at room temperature. The deformation behavior was analyzed based on powder content and the use or absence of plasticizer within the ceramic green tape. Furthermore, cold embossing tests with uniaxial compression tools were carried out. A channel structure was used as a test vehicle to allow investigations into stability against elastic recovery. In the first series of tests, various green tape compositions were investigated. Inferences were made, based on the elastic and plastic material behavior. The characterisation of structured tapes in the green state was carried out by using SEM and by scanning the surface area by confocal white light microscopy.