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Immersion soldering - a new way for ultra fine pitch bumping

 
: Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

Reichl, H.:
Electronics goes green 2000+. A Challenge for the Next Millennium. Proceedings. Vol.1: Technical lectures : September 11 - 13, 2000, Berlin, Germany
Berlin: VDE-Verlag, 2000
ISBN: 3-8007-2569-X
pp.165-168
Joint International Congress and Exhibition "Electronics goes green 2000+" <1, 2000, Berlin>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-22303.html