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Immersion soldering - a new way for ultra fine pitch bumping
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2000
Conference Paper
Title
Immersion soldering - a new way for ultra fine pitch bumping
Author(s)
Nieland, S.
Ostmann, A.
Aschenbrenner, R.
Reichl, H.
Mainwork
Electronics goes green 2000+. A Challenge for the Next Millennium. Proceedings. Vol.1: Technical lectures
Conference
Joint International Congress and Exhibition "Electronics goes green 2000+" 2000
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
