Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Experimental and numerical analyses of flip-chip attach reliability
| Kim, J.K. ; Hong Kong University of Science and Technology, Department of Mechanical Engineering; Components, Packaging and Manufacturing Technology Society -CPMT-, Hong Kong Chapter; Electronic Packaging Laboratory -EPACK LAB-, Hong Kong:
International Symposium on Electronic Materials and Packaging, EMAP 2000 : November 30 - December 2, 2000, Hong Kong
Piscataway, NJ: IEEE Order Department, 2000
ISBN: 0-7803-6654-9
pp.107-114 |
| International Symposium on Electronic Materials and Packaging (EMAP) <2, 2000, Hong Kong> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |