Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Improving module performance and reliability in power electronic applications by monolithic integration of RC-snubbers

Erhöhung der Leistungsfähigkeit und Zuverlässigkeit leistungselektronischer Module durch monolithische Integration von Bedämpfungsbauelementen. Erhöhte Modulleistung und Zuverlässigkeit in Leistungselektronischen Anwendungen durch monolithische Integration von RC-Snubbern

: Erlbacher, Tobias; Schwarzmann, Holger; Bauer, Anton J.; Berberich, Sven E.; Dorp, Joachim vom; Frey, Lothar

Postprint urn:nbn:de:0011-n-2201262 (381 KByte PDF)

MD5 Fingerprint: dccfc4a5dd19b085903b184b80bb34fd

© 2012 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

Created on: 30.11.2012

DOI: 10.1109/ISPSD.2012.6229078

	Institute of Electrical and Electronics Engineers -IEEE-; IEEE Electron Devices Society; IEEE Power Electronics Society: ISPSD 2012, 24th International Symposium on Power Semiconductor Devices & ICs. Proceedings : 3-7 June 2012, Bruges, Belgium Piscataway/NJ: IEEE, 2012 ISBN: 978-1-4577-1594-5 (Print) ISBN: 978-1-4577-1596-9 (Online) ISBN: 978-1-4577-1597-6 pp.283-286
	International Symposium on Power Semiconductor Devices & ICs (ISPSD) <24, 2012, Bruges>

	English
	Conference Paper, Electronic Publication
	Fraunhofer IISB ()
	capacitance; capacitor; electromagnetic interference; reliability; resistance; silicon; snubber; RC-snubber; dielectric reliability; monolithic integration; power module; high integration density; lifetime prediction; module performance; power electronic applications; tight tolerances

Abstract
Monolithic integration of RC snubbers in power electronic applications offers great opportunities. The presented devices provide tight tolerances and enable high integration densities. Especially, the incorporation into power modules enables reduction of electromagnetic interferences in accordance with reliable lifetime predictions.

: http://publica.fraunhofer.de/documents/N-220126.html