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Reliability of silver sintering on DBC and DBA substrates for power electronic applications

 
: Kraft, S.; Schletz, A.; Maerz, M.

:
Postprint urn:nbn:de:0011-n-2199040 (662 KByte PDF)
MD5 Fingerprint: b5ada365c34d2fead141a04be6cfb3fc
Created on: 11.05.2013


Energietechnische Gesellschaft -ETG-; European Center for Power Electronics -ECPE-:
CIPS 2012, 7th International Conference on Integrated Power Electronics Systems. Proceedings : March, 6 - 8, 2012, Nuremberg, Germany; incl. CD-ROM
Berlin: VDE-Verlag, 2012 (ETG-Fachbericht 133)
ISBN: 978-3-8007-3414-6
ISSN: 0341-3934
pp.439-444
International Conference on Integrated Power Electronics Systems (CIPS) <7, 2012, Nuremberg>
English
Conference Paper, Electronic Publication
Fraunhofer IISB ()
semiconductor diodes; silver sintering; substrates; DBC; DBA

Abstract
In terms of reliability standard power electronic modules are at their limit regarding robustness aspects. As a high reliable alternative for assembly processes such as Sn-based soldering and aluminum wire bonding, the assembly with nano silver sintering technology on different substrate materials has been investigated in this work. The reliability of silver sintered top and bottom side interconnects has been determined by end-of-life active power cycling testing with 50 mm(exp 2) commercial diodes from Infineon sintered on DBC (direct bonded copper) and DBA (direct bonded aluminum) substrates with a sintered silver ribbon for the top side connect. The setup with DBC substrate showed a 17 times, the one with DBA substrates a 2.7 times higher statistical lifetime than the soldered and wire bonded reference. Delamination of the sintered layers and with a progressing aging in active temperature cycles also showed oxidized cracks in the Cu metallization of the substrate as new failure mechanisms of the DBC samples with double sided sinter technology. For DBA assemblies a formation of hillocks on the Al surface underneath the diode could be detected next to delamination of the sinter layer.

: http://publica.fraunhofer.de/documents/N-219904.html