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System Packaging by Embedding: Technologies, Examples and Perspectives
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2011
Conference Paper
Titel
System Packaging by Embedding: Technologies, Examples and Perspectives
Author(s)
Löher, Thomas
Böttcher, Lars
Schütze, David
Karaszkiewicz, Stefan
Ostmann, Andreas
Aschenbrenner, Rolf
Hauptwerk
ICEP 2011, International Conference on Electronics Packaging. CD-ROM
Konferenz
International Conference on Electronics Packaging (ICEP) 2011
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM