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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

System Packaging by Embedding: Technologies, Examples and Perspectives

 
: Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf

Uenishi, K. ; Japan Institute of Electronics Packaging -JIEP-:
ICEP 2011, International Conference on Electronics Packaging. CD-ROM : April 13 - 15, 2011, Nara, Japan
Kyoto, 2011
5 pp.
International Conference on Electronics Packaging (ICEP) <2011, Nara>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-219745.html