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A Thermal Model for Non-linear Distortion in Printed Circuit Lines for Condition Monitoring of Electronics

 
: Krueger, Michael; Middendorf, Andreas; Nissen, Nils F.; Reichl, Herbert; Lang, Klaus-Dieter

Orii, Y. ; Japan Institute of Electronics Packaging -JIEP-; International Microelectronics and Packaging Society -IMAPS-, Japan Chapter:
ICEP-IAAC 2012, International Conference on Electronics Packaging. IMAPS All Asia Conference. CD-ROM : April 17 - 20, 2012, Tokyo, Japan
Tokyo, 2012
International Conference on Electronics Packaging (ICEP) <2012, Tokyo>
International Microelectronics and Packaging Society (IMAPS All Asia Conference IAAC) <2012, Tokyo>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-219697.html