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A Thermal Model for Non-linear Distortion in Printed Circuit Lines for Condition Monitoring of Electronics
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2012
Conference Paper
Titel
A Thermal Model for Non-linear Distortion in Printed Circuit Lines for Condition Monitoring of Electronics
Author(s)
Krueger, Michael
Middendorf, Andreas
Nissen, Nils F.
Reichl, Herbert
Lang, Klaus-Dieter
Hauptwerk
ICEP-IAAC 2012, International Conference on Electronics Packaging. IMAPS All Asia Conference. CD-ROM
Konferenz
International Conference on Electronics Packaging (ICEP) 2012
International Microelectronics and Packaging Society (IMAPS All Asia Conference IAAC) 2012
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM