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Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology
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2012
Conference Paper
Titel
Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology
Author(s)
Balaj, I.
Raschke, R.
Baum, M.
Uhlig, S.
Wiemer, M.
Gessner, T.
Grafe, J.
Hauptwerk
Smart Systems Integration 2012. CD-ROM
Konferenz
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2012
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM