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Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology

 
: Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.; Grafe, J.

Gessner, T. (Hrsg.) ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2012. CD-ROM : Zurich, Switzerland, 21 - 22 March 2012, 6th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components
Berlin: VDE-Verlag, 2012
ISBN: 978-3-8007-3423-8
Paper 53
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <6, 2012, Zurich>
English
Conference Paper
Fraunhofer ENAS ()
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-218803.html