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Micro hot embossing and micro laser welding technologies for fluidic applications

 
: Baum, M.; Besser, J.; John, B.; Keiper, B.; Hänel, J.; Wiemer, M.; Gessner, T.

Hoffmann, Martin (Hrsg.) ; TU Ilmenau:
MME 2012, 23rd Micromechanics and Microsystems Europe Workshop. USB-Stick : September 9 - 12, Ilmenau, Germany; Proceedings
Ilmenau: Technische Universität Ilmenau, 2012
ISBN: 978-3-938843-71-0
Paper A12-1673, 3 pp.
Micromechanics and Microsystems Europe Workshop (MME) <23, 2012, Ilmenau>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
This paper will show the realization of micro structures in polymeric materials including the preparation of high precision embossing masters. For embossing a two-depth silicon master tool was developed, that is known as 2.5 dimensional pattern. Goal of the investigation and reason for the second depth was the implementation of a special welding structure and the realization of smallest possible join formation between polymer substrates. After the Si master tool was realized the micro structures were molded to a so called soft working stamp. Using this stamp the patterns were transferred to a polymeric substrate under accompanying characterization and measurement. At least the channel like structures should be covered by another polymer. Therefore a laser transmission welding process was developed. With an additional absorbing layer two transparent substrates were welded by an infrared laser. Finally the strength of the bonding interface was character-ized by a micro chevron pull test.

: http://publica.fraunhofer.de/documents/N-218801.html