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Ultra precision grinding of wafer scale

: Hünten, M.; Klocke, F.; Dambon, O.; Bulla, B.


Lee, W.B. ; Asian Society for Precision Engineering and Nanotechnology -ASPEN-:
Precision Engineering and Nanotechnology. Proceedings : Selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong
Dürnten: Trans Tech Publications, 2012 (Key engineering materials 516)
ISBN: 978-3-03785-428-0 (Print)
ISBN: 978-3-03795-247-4 (CD-ROM)
ISBN: 978-3-03813-842-6 (EBook)
Asian Society for Precision Engineering and Nanotechnology (ASPEN International Conference) <4, 2011, Hong Kong>
Conference Paper
Fraunhofer IPT ()

Manufacturing moulds for the wafer-scale replication of precision glass optics sets new demands in terms of grinding tool lifetime and the processes to be applied. This paper will present different approaches to grinding processes and kinematics to machine wafer-scale tungsten carbide moulds with diameters of up to 100 mm and more than 100 single aspheric cavities, each featuring form accuracies in the micron range. The development of these processes will be described and advantages and disadvantages of the approaches derived from practical tests performed on an ultra precision grinding machine (Moore Nanotech 350FG) will be discussed. Finally, a comparison between the developed processes is made where achieved form accuracies and surface topography are analyzed.