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Investigation of the use of solderjet bumping for joining the thin-walled glass package of a complex mechatronic lens implant

: Rheinschmitt, Liane; Burkhardt, Thomas; Nagel, Jörg A.; Beckert, Erik; Gengenbach, Ulrich; Bretthauer, Georg


Deutsche Gesellschaft für Biomedizinische Technik -DGBMT-; Univ. Freiburg/Brsg., Institut für Mikrosystemtechnik -IMTEK-:
BMT 2012, Biomedizinische Technik. Proceedings 46. DGBMT Jahrestagung : Jena, September 16 - 19, 2012
Berlin: De Gruyter, 2012 (Biomedizinische Technik 57, 2012, Supplement 1)
Deutsche Gesellschaft für Biomedizinische Technik (DGBMT Jahrestagung) <46, 2012, Jena>
Conference Paper, Journal Article
Fraunhofer IOF ()

The Artificial Accommodation System is a lens implant that shall restore the accommodation ability of the eye. This complex mechatronic micro system has to be encapsulated by a transparent hermetic package that also permits electromagnetic transfer of energy and data. Moreover, the production process of the package must not apply thermal stress to the internal components. This paper introduces an approach to build a glass package consisting of two glass parts manufactured by ultrasonic grinding. In order to join both parts, Solderjet Bumping is used. During this laser-based process single bumps of metal solder can be placed in order to connect the assembly parts. The hermeticity of the thereby produced glass packages is tested using helium leak tests. Furthermore, the influence of the metal ring on the power transfer efficiency is measured.