English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
Temporary bonding: Electrostatic
Details
Full
Export
Statistics
Options
2012
Book Article
Titel
Temporary bonding: Electrostatic
Author(s)
Landesberger, C.
Klumpp, A.
Bock, K.
Hauptwerk
Handbook of wafer bonding
DOI
10.1002/9783527644223.ch19
Language
English
google-scholar
View Details
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT