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High current conductors in LTCC

 
: Ziesche, S.; Ihle, M.; Eberstein, M.

Müller, Jens ; International Microelectronics and Packaging Society -IMAPS-; American Ceramic Society -ACerS-, Westerville/Ohio:
IMAPS/ACerS 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2012. Proceedings : April 16-19, 2012, Erfurt, Germany
Erfurt, 2012
pp.25-29
International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) <8, 2012, Erfurt>
English
Conference Paper
Fraunhofer IKTS ()
LTCC; high current conductors; current load capacity; amapacity; laser ablation

Abstract
The publication discusses the possibilities of integrating high cross section - metallization structures within fired LTCC substrates. After comparison of different methods for building such metallization structures it focuses on laser ablation to form channel structures, which will be further filled by stencil printing. Furthermore the variants of firing LTCC substrates with high amounts of metallization are discussed and our chosen solution is presented. Finally the processed LTCC substrates are characterized and their ampacities discussed.

: http://publica.fraunhofer.de/documents/N-211455.html