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MEMS module integration into SiGe BiCMOS technology for embedded system applications

 
: Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Suchodoletz, M.V.; Zoschke, K.; Kaletta, K.; Ehrmann, O.; Leidich, S.; Kurth, S.; Tillack, B.

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Institute of Electrical and Electronics Engineers -IEEE-:
SCD 2011, IEEE Semiconductor Conference Dresden. Technology, Design, Packaging, Simulation and Test. CD-ROM : 27-28 Sept. 2011, Dresden, International Conference, Workshop and Table-top Exhibition
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0431-4
ISBN: 978-1-4577-0430-7
ISBN: 978-1-4577-0429-1
Art. 6068738
Semiconductor Conference <2011, Dresden>
English
Conference Paper
Fraunhofer IZM ()
Fraunhofer ENAS ()

Abstract
The latest developments in RF-MEMS technology have paved the way for achieving high performance systems. Integration of MEMS modules into a BiCMOS process using an embedded solution is appearing to be the most promising one to enable the realization of fully integrated smart systems. This work gives an overview on different RF-MEMS modules integrated to a 0.25m SiGe BiCMOS process. Back-end-of-line (BEOL) Integration, Substrate-Etch and Above-IC modules for mm-wave applications are detailed by different MEMS device examples.

: http://publica.fraunhofer.de/documents/N-208929.html