2011
Conference Paper
Title

MEMS module integration into SiGe BiCMOS technology for embedded system applications

Abstract
The latest developments in RF-MEMS technology have paved the way for achieving high performance systems. Integration of MEMS modules into a BiCMOS process using an embedded solution is appearing to be the most promising one to enable the realization of fully integrated smart systems. This work gives an overview on different RF-MEMS modules integrated to a 0.25m SiGe BiCMOS process. Back-end-of-line (BEOL) Integration, Substrate-Etch and Above-IC modules for mm-wave applications are detailed by different MEMS device examples.
Author(s)
Kaynak, M.
Wietstruck, M.
Zhang, W.
Drews, J.
Knoll, D.
Korndörfer, F.
Wipf, C.
Schulz, K.
Suchodoletz, M.V.
Zoschke, K.
Kaletta, K.
Ehrmann, O.
Leidich, S.
Kurth, S.
Tillack, B.
Mainwork
Conference
Open Access
DOI
Additional link
Language
English