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Correlation based local measurement of small CTE for high temperature power electronics packaging

 
: Hammacher, J.; Dost, M.; Seiler, B.; Scheiter, L.; Noack, E.; Rzepka, S.; Michel, B.

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Institute of Electrical and Electronics Engineers -IEEE-:
SCD 2011, IEEE Semiconductor Conference Dresden. Technology, Design, Packaging, Simulation and Test. CD-ROM : 27-28 Sept. 2011, Dresden, International Conference, Workshop and Table-top Exhibition
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0431-4
ISBN: 978-1-4577-0430-7
ISBN: 978-1-4577-0429-1
Art. 6068734
Semiconductor Conference <2011, Dresden>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
The image based displacement analysis called Digital Image Correlation (DIC) can be used as an alternative to classical TMA and other bulk methods to measure CTE-values of electronic packaging materials. By combining the operation of the thermally optimized commercial equipment EQUINOX from the company OMI and the correlation software VEDDAC of CWM GmbH Chemnitz, it was possible to develop a method to acquire anisotropic CTE values of specimens locally and with an accuracy of +/- 0.5*10 -6 /K over the entire value scale.

: http://publica.fraunhofer.de/documents/N-208924.html