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20% efficient screen-printed and aluminum-alloyed back-contact back-junction cells and interconnection scheme of point-shaped metalized cells

 
: Woehl, R.; Keding, R.; Rüdiger, M.; Gentischer, H.; Clement, F.; Wilde, J.; Biro, D.

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Postprint urn:nbn:de:0011-n-2089049 (795 KByte PDF)
MD5 Fingerprint: 3d6b55bd6e4973d7278973a6bfe4ee01
© 2011 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Created on: 3.8.2012


IEEE Electron Devices Society:
37th IEEE Photovoltaic Specialists Conference, PVSC 2011 : 19-24 June 2011, Seattle, WA, USA
Piscataway: IEEE, 2011
ISBN: 978-1-4244-9966-3
ISBN: 978-1-4244-9965-6 (print)
pp.48-52
Photovoltaic Specialists Conference (PVSC) <37, 2011, Seattle/Wash.>
English
Conference Paper, Electronic Publication
Fraunhofer ISE ()
PV Produktionstechnologie und Qualitätssicherung; Silicium-Photovoltaik; Oberflächen - Konditionierung; Passivierung; Lichteinfang; Kontaktierung und Strukturierung; Herstellung und Analyse von hocheffizienten Solarzellen; Industrielle und neuartige Solarzellenstrukturen

Abstract
A back-contact back-junction silicon solar cell is presented that was exclusively structured and metalized by screen-printing technology. On n-type base material the emitter was formed by locally printed and alloyed aluminum structures in a co-firing process. By a varying emitter coverage on the rear the influence on the collection probability and thus the short-circuit current density is analyzed by light beam induced current (LBIC) measurements. Efficiencies of up to 20% were realized and independently confirmed by Fraunhofer ISE CalLab. Two-dimensional simulations of the cell structure are performed and agree well with the processed cell. Variations of several parameters show room for further efficiency increase. Furthermore a new module concept for back-contact cells is presented where the metallization on cell level is point-shaped. The lateral conductance of collected carriers is enabled on module level by a structured printed circuit board. On the contacts an adh esive agent is screen-printed in order to make the aluminum contacts solderable. Afterwards a soldering paste is screen-printed which connects the cell and the printed circuit board or foil during a reflow process. This concept overcomes the restriction in cell size of back-contact back-junction modules due to thick copper layer.

: http://publica.fraunhofer.de/documents/N-208904.html