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2011
Conference Paper
Titel
Fabrication and characterisation of CNT via interconnects for application in ULSI circuits
Abstract
We designed and fabricated carbon nanotube (CNT) vias based on a metal/CNT hybrid technology. CNTs were grown vertically aligned in the VIA holes, using a catalyst underlayer controlled, site selective, thermal CVD approach. For stabilization of the CNT array procedures with different dielectric fillers and the effects of CMP were investigated. We show the feasibility of applying a low-k material for embedding the CNTs using a spin-on technique. Electrical characterisation of the CNT vias were performed.