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Fabrication and characterisation of CNT via interconnects for application in ULSI circuits

 
: Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.

Advanced Metallization Conference 2011
Red Hook, NY: Curran, 2011
ISBN: 978-1-61839-426-2
pp.96-97
Advanced Metallization Conference (AMC) <2011, San Diego>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
We designed and fabricated carbon nanotube (CNT) vias based on a metal/CNT hybrid technology. CNTs were grown vertically aligned in the VIA holes, using a catalyst underlayer controlled, site selective, thermal CVD approach. For stabilization of the CNT array procedures with different dielectric fillers and the effects of CMP were investigated. We show the feasibility of applying a low-k material for embedding the CNTs using a spin-on technique. Electrical characterisation of the CNT vias were performed.

: http://publica.fraunhofer.de/documents/N-208876.html