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Thermal management in high-density power converters

: März, M.

ICIT 2003, International Conference on Industrial Technology. Proceedings : December 10 - 12, 2003
Maribor, 2003
International Conference on Industrial Technology (ICIT) <2003, Maribor/Slovenia>
Conference Paper
Fraunhofer IISB ()
thermal management; high-density power converter; electronic cooling; multifunctional board integration

This paper gives an overview of basic principles of the thermal management in high-density power converters. Methods for heat removal on a device and circuit board level are discussed. New packaging technologies for discrete power semiconductors as well as multifunctional board integration techniques are included. A view is given on future 3D integration techniques that take into account the poor thermal conductivity especially of the passive component materials. With these techniques much higher power densities are possible. Some examples of prototype systems are presented, together with the achieved technical data.