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Assembly and interconnect formation in MEMS/MOEMS application

: Oppermann, H.


Garcia-Blanco, S.M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Reliability, packaging, testing and characterization of MEMS/MOEMS and nanodevices XI : 23 - 24 January 2012, San Francisco, California, United States
Bellingham, WA: SPIE, 2012 (Proceedings of SPIE 8250)
ISBN: 978-0-8194-8893-0
Paper 825002
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices Conference <11, 2012, San Francisco/Calif.>
Conference Paper
Fraunhofer IZM ()

Integration of MEMS and MOEMS requires very compact packages with short interconnects which are found in 3D packages. We will give an overview on assembly methods like chip-to-chip, chip-to-wafer and wafer-to-wafer. For the variety of applications different interconnection methods are shown: reflow soldering, transient liquid phase bonding and transient liquid phase soldering, thermocompression and thermosonic bonding as well as sintering of silver paste or new materials like nanosponge.