Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Assembly and interconnect formation in MEMS/MOEMS application
| Garcia-Blanco, S.M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Reliability, packaging, testing and characterization of MEMS/MOEMS and nanodevices XI : 23 - 24 January 2012, San Francisco, California, United States
Bellingham, WA: SPIE, 2012 (Proceedings of SPIE 8250)
ISBN: 978-0-8194-8893-0
Paper 825002 |
| Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices Conference <11, 2012, San Francisco/Calif.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |
Abstract
Integration of MEMS and MOEMS requires very compact packages with short interconnects which are found in 3D packages. We will give an overview on assembly methods like chip-to-chip, chip-to-wafer and wafer-to-wafer. For the variety of applications different interconnection methods are shown: reflow soldering, transient liquid phase bonding and transient liquid phase soldering, thermocompression and thermosonic bonding as well as sintering of silver paste or new materials like nanosponge.