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Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling

 
: Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.

:

Institute of Electrical and Electronics Engineers -IEEE-:
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 : 16 - 18 April 2012, Cascais, Portugal
Piscataway: IEEE, 2012
ISBN: 978-1-4673-1512-8
ISBN: 978-1-4673-1513-5
pp.134-139
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <13, 2012, Cascais>
English
Conference Paper
Fraunhofer IZM ()
Fraunhofer ENAS ()

Abstract
An analysis of moisture transport through the bulk of a crosslinked epoxy has been performed experimentally and by molecular dynamics simulations. It was shown that results of the diffusion coefficient compare well for the investigated system and an analysis of the activation energy gives reasonable agreement between experiment and simulation.

: http://publica.fraunhofer.de/documents/N-206464.html