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Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production

 
: Maus, I.; Pape, H.; Nabi, H.S.; Goroll, M.; Preu, H.; Keller, J.; Ernst, L.J.; Michel, B.; Wunderle, B.

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Institute of Electrical and Electronics Engineers -IEEE-:
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 : 16 - 18 April 2012, Cascais, Portugal
Piscataway: IEEE, 2012
ISBN: 978-1-4673-1512-8
ISBN: 978-1-4673-1513-5
pp.403-409
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <13, 2012, Cascais>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
Interfacial delamination has become one of the most important reliability issues in the microelectronic industry, and therefore more and more focus is set on related research.

: http://publica.fraunhofer.de/documents/N-206446.html