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Precision assembly of a miniaturized wire deflector for electron-beam lithography

: Risse, Stefan; Damm, Christoph; Hornaff, Marcel; Kamm, Andreas; Mohaupt, Matthias; Eberhardt, Ramona; Schmidt, Ingo; Ramm, Roland; Kühmstedt, Peter; Notni, Gunther; Döring, Hans-Joachim; Elster, Thomas; Kirschstein, Ulf Carsten; Schenk, Christoph


Microelectronic engineering 97 (2012), pp.100-104
ISSN: 0167-9317
International Conference on Micro- and Nano-Engineering (MNE) <37, 2011, Berlin>
Conference Paper, Journal Article
Fraunhofer IOF ()
electron beam lithography; wire deflector; electron-optical column; precision assembly; solderjet bumping multi shaped beam; computed tomography measurement

The fast and precise deflection of electron-beams is mandatory for common electron beam tools and next generation multi-beam lithography systems. Electrostatic fields generated by an arrangement of electrodes with several electric potentials are used to control the electron beam. The miniaturization of such a beam-deflection system facilitates its integration at a favorable place within the electron-optical column. An efficient and accurate beam deflection with high sensitivity and low aberrations is consequently possible. The novel wire-based electrostatic deflector for electron-beam Lithography Tools presented in this paper strictly pursues this approach. Design investigations as well as manufacturing and alignment procedures are reported. 24 wire electrodes are arranged in a circular FEA-optimized pattern and kinematically well-defined mounted to a supporting structure using the Solderjet Bumping technique . This flux free solder technique ensures vacuum compatible j oints free of hydrocarbons and with an excellent long-term stability. A prototype of the wire deflector is measured by means of a high resolution X-ray computer tomography scanner (CT) . The single wire elements of the wire deflector are symmetrically arranged to each other within an accuracy of a few microns.