Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

SiCer - an advanced substrate for 3D integrated nano and micro systems

 
: Fischer, M.; Mache, T.; Bartsch, H.; Müller, J.; Pawlowski, B.; Barth, S.

Gessner, T. ; European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components; Fraunhofer Research Institution for Electronic Nano Systems ENAS:
Smart systems integration 2011. 5th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM : Dresden, Germany, 22 - 23 March 2011
Berlin: VDE-Verlag, 2011
ISBN: 978-3-8007-3324-8
Paper 7, 5 pp.
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <5, 2011, Dresden>
English
Conference Paper
Fraunhofer IKTS ()
monolithic silicon

Abstract
A monolithic silicon ceramic sandwich substrate (SiCer) suitable for 3D integration of nano and micro systems is presented. It is high temperature-stable and offers several options for TSV fabrication and wafer level packaging. The ceramic layer acts as carrier. Thus, the silicon layer can be kept as thin as necessary to ensure the electronic or sensor tasks. Silicon systems are separated on the ceramic layer with standard etching technologies. The thermal and electrically isolated MEMS or NEMS devices are stress free connected to a standard carrier system. Prospectively, it is possible to fabricate SiCer as a semi-finished wafer substrate with TSVs and LTCC interconnects in standardised grid dimensions, so user without LTCC/assembling technology can continue e. g. with MEMS processing.

: http://publica.fraunhofer.de/documents/N-205142.html