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In-situ investigation of the interplay between microstructure and anodic copper dissolution under near-ECM conditions. Pt.2: The transpassive state

 
: Schneider, M.; Schroth, S.; Richter, S.; Höhn, S.; Schubert, N.; Michaelis, A.

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Electrochimica Acta 70 (2012), pp.76-83
ISSN: 0013-4686
English
Journal Article
Fraunhofer IKTS ()
anodic copper dissolution; EBSD; electrochemical machining (ECM); grain orientation; In-situ microscopy

Abstract
During the anodic dissolution of pure copper in sodium nitrate under near-ECM conditions the influence of the crystallographic orientation of individual grains on the dissolution behaviour was simultaneously investigated. Two different states can be distinguished - the active and the transpassive state. The dissolution shows a continuous transition from one state to the other, depending on the current density j c which itself is determined by the velocity of the electrolyte. For j < j c the active state is marked by an orientation dependant anodic dissolution. Above the critical density j c the crystallographic orientation of the grains is no longer an influencing factor and therefore a homogenous dissolution takes place. This is called the transpassive state which will be analysed in t his paper in detail. For this, in-situ-experiments combining electrochemistry and optical microscopy together with EBSD investigations and current efficiency measurements had been undertaken.

: http://publica.fraunhofer.de/documents/N-203394.html