Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
| DE 2002156247 A: 20021129 |
| WO 2003EP13434 A: 20031128 |
| WO 2004051708 A2: 20040617 |
|
| German |
| Patent, Electronic Publication |
| Fraunhofer IFAM () |
Abstract
The invention relates to a method and a device for machining wafers, in particular for thinning wafers. The invention also relates to a wafer comprising a support layer and a separation layer that is situated between the support layer and the wafer. Said separation layer is a plasma polymer layer, which adheres to the wafer and adheres to the support layer more strongly than to the wafer.