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Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer

 
: Jakob, A.; Vissing, K.-D.; Stenzel, V.

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Frontpage ()

DE 2002156247 A: 20021129
WO 2003EP13434 A: 20031128
WO 2004051708 A2: 20040617
German
Patent, Electronic Publication
Fraunhofer IFAM ()

Abstract
The invention relates to a method and a device for machining wafers, in particular for thinning wafers. The invention also relates to a wafer comprising a support layer and a separation layer that is situated between the support layer and the wafer. Said separation layer is a plasma polymer layer, which adheres to the wafer and adheres to the support layer more strongly than to the wafer.

: http://publica.fraunhofer.de/documents/N-201709.html