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Verfahren zur Beschichtung eines Substrates mit einer Schutzschicht, beschichtetes Substrat, elektronisches Bauteil sowie Verwendungszwecke

 
: Janietz, S.; Schulze, K.; Egorov-Brening, T.

:
Frontpage ()

DE 102010027239 A
German
Patent, Electronic Publication
Fraunhofer IAP ()

Abstract
Coating a substrate comprising at least one thermoplastic material or its blend with a protective layer, comprises wetting the substrate at least partially with a solution comprising at least one crosslinking agent and at least one polymer, which is reactive with the crosslinking agent to form a crosslinked polymer, dissolved in at least one solvent, and crosslinking the polymer with the crosslinking agent to form the protective layer. The polymer comprises repeating units of phenol derivative (I) and/or alcohol derivative (II). The crosslinking agent comprises a melamine derivative (III). Coating a substrate comprising at least one thermoplastic material or its blend with a protective layer, comprises wetting the substrate at least partially with a solution comprising at least one crosslinking agent and at least one polymer, which is reactive with the crosslinking agent to form a crosslinked polymer, dissolved in at least one solvent, and crosslinking the polymer with the crosslinking agent to form the protective layer. The polymer comprises repeating units of phenol derivative of formula (I) and/or alcohol derivative of formula ([-CH 2-CH(OH)-](II). The crosslinking agent comprises a melamine derivative of formula (III). Y1 : -NH 2, -NH[(CH 2) a-O-Z] or -N[(CH 2) a-O-Z] 2; a : 1-12; and Z : optionally branched 1-12C alkyl, where at least two of Y1 is -NH[(CH 2) a-O-Z] or -N[(CH 2) a-O-Z] 2. Independent claims are also included for: (1) the substrate comprising at least one thermoplastic material or its blend, which comprises at least partially applied protective layer comprising a crosslinked product of at least one crosslinking agent and at least one polymer comprising repeating units (I) and/or (II); and (2) an electronic component comprising the substrate. [Image]

: http://publica.fraunhofer.de/documents/N-199596.html