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Solder joining of a miniaturized laser on a multi-material smart platform

 
: Burkhardt, Thomas; Beckert, Erik; Hornaff, Marcel; Thiele, Julia; Burkhardt, Diana; Galan, Miguel; Gilaberte, Marta; Ferrando, Sergi; Montes, David; Ribes, Pol; Eberhardt, Ramona; Tünnermann, Andreas

Gessner, T. (Hrsg.) ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2012. CD-ROM : Zurich, Switzerland, 21 - 22 March 2012, 6th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components
Berlin: VDE-Verlag, 2012
ISBN: 978-3-8007-3423-8
Paper 60
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <6, 2012, Zurich>
English
Conference Paper
Fraunhofer IOF ()
solderjet bumping; laser soldering; ExoMars; photonic packaging

Abstract
A green solid state laser for the joint ESA/NASA EXOMARS mission is presented. Multi-material integration on smart AIN-based ceramic substrate using flux-free laser-based soldering techniques is described. Solder joining allows for an organic-free assembly of the redundant two channel design of a Nd:YAG laser with BBO second harmonic generation. Investigation of the soldering processes is carried out with respect of the most crucial components of the laser assembly, particulary the resonator mirror and the fold mirror. Possible solder joint designs are investigated with respect to achievable alignment accuracy. Two different flux free laser soldering processes are used: thin film soldering utilizing a sputtered eutectic gold-tin solder and Solderjet Bumping offering very good 3D integration capabilities.

: http://publica.fraunhofer.de/documents/N-199410.html