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Metal thermo compression bonding at wafer level and its capabilities for 3D integration

 
: Baum, M.; Roscher, F.; Froemel, J.; Jia, C.; Rank, H.; Hausner, R.; Reichenbach, R.; Wiemer, M.; Gessner, T.

Knechtel, R.:
WaferBond 2011, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts : 6th - 8th December 2011, Chemnitz, Germany
Chemnitz: Fraunhofer ENAS, 2011
pp.83
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2011, Chemnitz>
English
Conference Paper
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-198836.html