Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

New generation of electrostatic carrier technology (T-ESC) for reversible thin wafer clamping with seal glass bonding

 
: Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.

Knechtel, R.:
WaferBond 2011, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts : 6th - 8th December 2011, Chemnitz, Germany
Chemnitz: Fraunhofer ENAS, 2011
pp.111
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2011, Chemnitz>
English
Abstract
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-198835.html