Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. The role of Au/Sn solder in packaging
| Zschech, E.; Mikolajick, T.; Whelan, C.:
Materials for Information Technology: Devices, Interconnects and Packaging
New York: Springer, 2005 (Engineering Materials and Processes)
ISBN: 1-85233-941-1 (print)
ISBN: 978-1-8462-8235-5
pp.377-390 |
| Biennial meeting of the Federation of European Materials Societies (FEMS) <2003, Lausanne> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |