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The importance of polymers in wafer-level packaging

 
: Töpper, M.

:

Zschech, E.; Mikolajick, T.; Whelan, C.:
Materials for Information Technology: Devices, Interconnects and Packaging
New York: Springer, 2005 (Engineering Materials and Processes)
ISBN: 1-85233-941-1 (print)
ISBN: 978-1-8462-8235-5
pp.347-361
Biennial meeting of the Federation of European Materials Societies (FEMS) <2003, Lausanne>
EUROMAT <8, 2003, Lausanne>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-198007.html