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Next Generation System in a Package Manufacturing by Embedded Chip Technologies

 
: Böttcher, Lars; Manessis, Dionysios; Karaszkiewicz, Stefan; Ostmann, Andreas; Reichl, Herbert

:

Journal of microelectronics and electronic packaging 7 (2010), No.3, pp.131-137
ISSN: 1551-4897
Device Packaging Conference <2010, Scottsdale/Ariz.>
English
Conference Paper, Journal Article
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-195522.html