Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Microelectronics packaging materials: Correlating structure and property using molecular dynamics simulations

: Hölck, Ole; Wunderle, Bernhard


Iwamoto, Nancy:
Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Boston/Mass.: Springer US, 2012
ISBN: 978-1-461-41728-6
ISBN: 978-1-461-41727-9
ISBN: 978-1-461-41728-6
Book Article
Fraunhofer IZM ()

This paper presents a combined experimental and simulative property analysis of cross-linked epoxy resins. Several different molecular modeling methods have been used to evaluate properties ranging from thermo-mechanical to diffusive properties, some of which have been found to produce good agreement between simulation and experiment, whereas others do show qualitative agreement and can thus be useful as a quick tendency assessment. The research has also brought forth a procedure to cross-linked structures complying strictly to three-dimensional boundary conditions: the special challenge lies in a cross-linking algorithm that produces cross-links that extend the network beyond the periodic unit cell, interconnecting the latter with its virtual images.