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Integration of optics electronics and mechanics on miniaturized platforms

 
: Beckert, E.; Damm, C.; Eberhardt, R.; Schreiber, P.

Büttgenbach, S.; Westkämper, E. ; Verband der Elektrotechnik, Elektronik, Informationstechnik -VDE-:
MICRO.tec 2003: Applications - trends - visions. Proceedings : 2nd VDE World Microtechnologies Congress, October 13 - 15, 2003, International Congress Centre, Munich, Germany
Berlin: VDE Verlag, 2003
ISBN: 3-8007-2791-9
pp.179-183
World Microtechnologies Congress (MICRO.tec) <2, 2003, München>
English
Conference Paper
Fraunhofer IOF ()
structured planar substrate; microassembly; soldering; LTCC-substrate

Abstract
The paper describes a concept that utilizes structured planar substrates based on low temperature confired ceramics (LTCC) as a platform for miniaturized, free space, two-dimensional optical systems with integrated electronics and electromechanics as well as the respective assembly technologies. The 3-dimensional shape of the laminated and fired ceramic structure provides different height levels for the optical components and mechanical stops for passive alignment. Thick-film printing and via punching can be incorporated to integrate single or multiplayer electronic assemblies directly into the platform of the optical system. The concept is scalable and it allows the embedding of silicon based microoptical pack ages necessary for fiber applications as well as the adaption to standards of microengineering like Match-X, but it also provides the interface to larger optical systems. The characteristics of an optical pick and place process for the assembly of such systems will also be discussed.

: http://publica.fraunhofer.de/documents/N-19125.html