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Packaging solutions for multi-functional and modular MEMS
|Reichl, H. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; MESAGO Messe Frankfurt GmbH, Stuttgart:|
Micro System Technologies 2003 : International Conference & Exhibition on Micro Electro, Opto, Mechanical Systems and Components, München, October 7-8, 2003
Poing: Franzis, 2003
|International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <2003, München>|
| Conference Paper|
|Fraunhofer IPA ()|
| miniaturization; modular MEMS; Verpackung|
Sensor and actor systems are constantly being miniaturized for a wide range of applications such as automotive systems, consumer electronics and in the investment goods industry. Demands for increased functional density, more intelligent systems for process control and for systems for monitoring and diagnosis are strengthening this trend. In the process, not only is the development of new products being demanded but also appropriate production technologies and technologies for integrating such miniaturized systems.
The trend to this effect is not only directed towards integrating electronic functions but also towards integrating optical, fluidic or mechanical functions, for example, which need to be solved using micro technology. For the most part, electronic systems can usually be solved monolithically on a chip basis in the form of multi-chip modules or on printed circuits. Multi-functional systems, however, require new strategies and solutions for their integration andpackaging. Reasons for this include different material requirements for module packaging, the combination of various packaging technologies within the system as well as the necessary assembly technologies. Opto-electronic and electromechanical systems often require a precise three-dimensional construction which cannot be achieved using layer technologies such as printed circuit technology.
The three-dimensional construction of multi-functional miniaturized systems is therefore an extension of printed circuit technology and will become more and more important in the future. In this way, the space available for the system can be optimally used and its integration into the complete system made easier.
In this article, packaging solutions and examples will be presented for the construction of three-dimensional multi-functional micro systems (optical and mechanical systems) and also for their integration. The systems are realized using known technologies, i.e. printed circuittechnology, ceramic technology and 3-D MID (Molded Interconnect Device) technology and combinations of these. Additionally, this article will explain how the use of different packaging technologies and combinations of them can contribute towards increased economical efficiency in the manufacture of such systems.