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Advantages of a new wafer level integration concept based on direct bonded silicon on LTCC
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2010
Conference Paper
Title
Advantages of a new wafer level integration concept based on direct bonded silicon on LTCC
Author(s)
Müller, J.
Fischer, M.
Bartsch de Torres, H.
Pawlowski, B.
Barth, S.
Mainwork
Pan Pacific Microelectronics Symposium and Tabletop Exhibition 2010
Conference
Pan Pacific Microelectronics Symposium 2010
Language
English
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS
