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Advantages of a new wafer level integration concept based on direct bonded silicon on LTCC

 
: Müller, J.; Fischer, M.; Bartsch de Torres, H.; Pawlowski, B.; Barth, S.

Surface Mount Technology Association -SMTA-:
Pan Pacific Microelectronics Symposium and Tabletop Exhibition 2010 : Kauai, Hawaii, 26 - 28 January 2010
Red Hook, NY: Curran, 2010
ISBN: 978-1-615-67947-8
pp.58-63
Pan Pacific Microelectronics Symposium <2010, Kauai/Hawaii>
English
Conference Paper
Fraunhofer IKTS ()

: http://publica.fraunhofer.de/documents/N-190858.html