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Studies on the reliability of power packages based on strength and fracture criteria

 
: Dudek, R.; Pufall, R.; Seiler, B.; Michel, B.

:

Institute of Electrical and Electronics Engineers -IEEE-:
12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 : Linz, Austria, 18 - 20 April 2011
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0107-8
ISBN: 978-1-4577-0106-1
Art.5765810, 8 pp.
International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz>
English
Conference Paper
Fraunhofer ENAS ()

Abstract
Thermal cycling induced failure in power packages has been studied comparing thermal cycling (TC) with thermal shock (TS) tests by thermo-mechanical analyses. The major question for the time reduction is that after the failure mechanism and if it changes with changed loading type and duration. These questions were addressed by theoretical analyses including coupled transient thermal-mechanical analyses and interface fracture mechanics applying the cohesive zone approach. By the latter, critical states for delamination failures could be derived. Finally, critical interface fracture parameters of the package were compared with results from the button shear test.

: http://publica.fraunhofer.de/documents/N-189834.html