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Establishing the critical fracture properties of the die backside-to-molding compound interface

: Schlottig, G.; Pape, H.; Wunderle, B.; Ernst, L.J.


IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 61st Electronic Components and Technology Conference, ECTC 2011 : Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings
Piscataway/NJ: IEEE, 2011
ISBN: 978-1-61284-497-8 (Print)
ISBN: 978-1-61284-498-5
ISBN: 978-1-61284-496-1
Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>
Conference Paper
Fraunhofer ENAS ()

This paper presents essential improvements to determining interfacial fracture properties of the silicon die-to-molding compound interface. The improvements affect specimen fabrication in two different molding technologies and experimental methods using the mixed mode chisel (MMC) setup. We show how to overcome pre-test fracture of the delamination specimens, how to extend the previously aimed fracture mode mix range, how to reduce the number of experiments necessary and extrapolation methods in order to apply the interface data in failure models.